An AI product may be a compact sensor node, an edge-computing module or a larger accelerator assembly. PCB requirements come from processor packaging, memory interfaces, power demand and the mechanical envelope. The label AI does not define a layer count, material grade or manufacturing process.
Engineering Review Points
- Processor escape routing: identify package pitch, fan-out and routing density. Review HDI build-up, microvia spans and via-in-pad treatment with the selected stack-up and assembly requirements.
- High-speed interfaces: provide impedance targets, data rates, loss requirements and approved materials. Review reference-plane continuity, connector launches and via stubs with the complete channel.
- Power and heat: describe rail currents, copper distribution, component heat sources and cooling interfaces. Coordinate board-level measures with the heatsink and enclosure; they do not replace system validation.
- Assembly and test access: define sourcing responsibility, package handling, inspection coverage, programming and functional-test access. Dense packages and underside heatsinks affect fixtures, rework and panel design.
Prepare Your Project Files
Send fabrication and drill data, stack-up, impedance tables, BOM, placement files and mechanical drawings. Include thermal and power constraints, approved substitutions, programming information and test criteria. State prototype and production quantities separately.