Package substrates and substrate-like PCBs require distinct qualification. An ordinary HDI capability does not establish suitability for every package substrate. Share package architecture, material requirements, routing geometry, microvia structure, surface finish, warpage limits and assembly interfaces for a manufacturing compatibility review.
View fabrication requirements and project review
Before Requesting a Quote
Provide the current Gerber or ODB++ package, drill data, fabrication drawing, quantity and delivery destination. For assembly, include the BOM and placement data. Material substitutions, inspection records and acceptance criteria should be agreed before production.
