Multilayer boards provide internal routing and reference planes. Select the layer count from connectivity, return paths, power distribution and mechanical constraints. Confirm dielectric construction, copper balance, via types, impedance targets and inspection records before approving the fabrication data.
View fabrication requirements and project review
Before Requesting a Quote
Provide the current Gerber or ODB++ package, drill data, fabrication drawing, quantity and delivery destination. For assembly, include the BOM and placement data. Material substitutions, inspection records and acceptance criteria should be agreed before production.
