PCB applications for communications automotive industrial and electronic equipment

PCB Applications Across Key Electronics Industries

HomePCB and PCBA Industry Solutions for Global OEM Projects

Select an Application, Then Review the PCB Construction It Requires

A board used in a smart watch, an automotive radar system, a 5G base station and an industrial battery module may all be called a PCB, but their design priorities are different. Compact products may need HDI build-up and fine line/space. Communications equipment may require controlled impedance and back drilling. Power electronics may need thicker copper and a structure designed around current and heat.

Use this page to find the application closest to your project. The configurations below illustrate how application requirements influence board construction. Your Gerber files, stack-up and operating conditions determine the final manufacturing review.

PCB Application Examples

These examples show how different application requirements can affect PCB structure. Final specifications are confirmed for each project.

Application Example PCB Configuration Project Points to Confirm
UAV and Industrial UAV Controllers 12-layer boards; project examples include second-order HDI, 75/75 μm line/space, 1.0 mm or 1.6 mm board thickness and 0.10 mm blind vias. Confirm controller function, vibration environment, board thickness, via structure and required surface finish.
Wearables, Smartphones and IoT Devices Project examples include 8-layer HDI boards for smart watches and 5G smartphones, plus 6-layer first-order HDI boards for IoT products. Confirm available board area, finished thickness, fine-line design, blind-via build-up and assembly constraints.
Automotive Connectivity and Multimedia Project examples include a 16-layer vehicle-system board for vehicle networking, radar and autonomous-driving applications, and a 10-layer third-order HDI automotive multimedia board. Confirm the electrical architecture, impedance needs, via-filling requirements, operating environment and documentation requirements.
5G Communications and Network Equipment Project examples include a 12-layer 5G base-station PCB with 60/60 μm line/space, as well as a 16-layer mechanical-blind-via board for a 5G base-station power module. Confirm signal requirements, impedance, back-drilling needs, layer stack-up, power distribution and test requirements.
Industrial Control, Medical Equipment and Security Project examples include a 20-layer industrial-control and medical-equipment board, 8-layer intelligent-security boards and 6-layer LED display boards. Confirm layer count, copper distribution, back drilling, via plugging, board thickness and end-use environment.
Battery and Power Electronics An industrial high-power battery charging-module example uses a 4-layer thick-copper construction with 3 oz inner-layer copper and 5 oz outer-layer copper. Confirm current path, copper weight, thermal load, minimum hole size, board thickness and surface-finish requirements.

PCB Solutions by Application

Choose the industry closest to your product to review the related application environment and PCB considerations.

Start with the Information That Affects Your PCB Build

For a useful engineering review, send your Gerber files, layer count, stack-up, finished board thickness, copper weight, via structure, impedance requirements, surface finish, quantity, panelization and test requirements. If the application involves high current, high density, mobile communication, automotive electronics or industrial use, describe the operating conditions and any special process requirements at the beginning.

Our HDI PCB and multilayer PCB pages can help you identify the relevant product direction before requesting a quotation.

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