Multilayer PCB performance depends on the complete stack-up, material system, copper distribution, lamination, registration, hole structures and acceptance criteria. Shenzhen Benchuang Precision Electronics Co., Ltd. confirms materials, manufacturing limits and test coverage only after reviewing the released project data.
A multilayer PCB combines outer and inner copper layers through one or more lamination cycles. The released stack-up should define core and prepreg construction, dielectric thicknesses, copper weights, finished thickness, material category, impedance relationships and any blind, buried or laser-via structure. Layer naming in the manufacturing data, stack-up drawing and impedance table must be consistent.
Material selection is reviewed against electrical performance, thermal requirements, finished thickness, copper and process route. Copper distribution and resin demand affect lamination, registration and flatness, so plane areas, heavy-copper regions and asymmetric constructions must be assessed before the panel plan is released.
Capability combinations depend on the complete board design. Final manufacturability is confirmed after reviewing the stack-up, material, copper, via structure, panel layout and order quantity.
| Parameter | Prototype/Sample | Production |
|---|---|---|
| Maximum layer count | 32 layers | 18 layers |
| Finished board thickness | Up to 6.0 mm | Up to 2.8 mm |
| Minimum dielectric thickness | 0.060 mm | 0.064 mm |
| Material categories | FR-4 / M2 / M4 / M6 / M7 | FR-4 / M2 / M4 / M6 |
| Minimum through-hole drill | 0.15 mm | 0.15 mm |
| Maximum PTH aspect ratio | 14:1 | 10:1 |
| Minimum inner-layer line/space | 45/45 µm | 45/50 µm |
| Minimum outer-layer line/space | 45/45 µm | 45/50 µm |
| Controlled-impedance tolerance | ±9% | ±10% |
| Minimum drill/pad | 0.12/0.25 mm | 0.15/0.30 mm |
| Inner-layer copper | 0.33–5 oz | 0.33–4 oz |
| Outer-layer copper | 0.33–5 oz | 0.33–5 oz |
| Maximum production panel | 600 × 400 mm | 600 × 400 mm |
| Surface finishes | ENIG, OSP, OSP + ENIG, ENEPIG, plated gold fingers | Same options |
| Special processes | POFV, countersink, backdrill, castellated/half holes, side plating | Available by design review |
Multilayer fabrication requires consistent inner-layer imaging and etching, controlled oxide or bonding preparation, material lay-up, lamination and registration before drilling and plating. DFM review checks dielectric selection, resin demand, copper distribution, layer symmetry, tooling strategy, dimensional compensation and the relationship between holes, pads and inner-layer clearances.
Heavy copper, large plane areas, mixed copper densities and asymmetric stack-ups can influence resin fill and flatness. If the design uses controlled-depth features, cavities, sequential lamination or other special constructions, identify them in the fabrication drawing and do not rely on layer filenames alone.
The via table should separate plated through holes, non-plated holes, blind vias, buried vias and laser microvias. For each structure, define the drill or finished diameter, layer span, pad sizes, fill and cap requirements and any stacked or staggered arrangement. Aspect ratio, copper thickness, finished board thickness and hole tolerance must be reviewed together.
Special processes such as plated-over-filled vias, backdrilling, countersinks, castellated or half holes and side plating require dedicated drawing notes and acceptance criteria. For backdrilling, provide the target layer, residual-stub requirement and verification method. Availability is confirmed against the complete design.
Controlled impedance is tied to the approved stack-up, dielectric properties and thickness, trace width and spacing, finished copper, reference planes and test method. Provide single-ended and differential targets with layer references and identify whether the values are design targets or test limits. Coupon design and measurement requirements should be released with the board data.
Manufacturing and acceptance controls may include material verification, AOI, electrical testing, dimensional and visual inspection, impedance testing, metallographic inspection, finish-thickness measurement and environmental or reliability testing when specified. State the required reports, sample plan and pass/fail criteria in the quotation package.
Describe the key requirements in the Message field. Our team will confirm the file-transfer method for the complete manufacturing package after receiving the inquiry.
Include the layer count, stack-up, material, copper, via structure, impedance requirements, quantity and target date. Our team will confirm the file-transfer method for the complete technical package.
Benchuang supports multilayer PCB projects from stack-up and DFM review through prototype, pilot and production planning. Founded in 2007, the company operates an approximately 40,000 m² Meizhou manufacturing center with nearly 500 employees. The Shenzhen team coordinates overseas quotations, technical communication and export support, while manufacturing review covers materials, lamination, via structures, controlled impedance, special processes and inspection requirements.
The stated capability is up to 32 layers for prototype/sample and 18 layers for production. Final approval depends on the complete stack-up, thickness, materials, copper, vias, panel plan and quantity.
Minimum inner- and outer-layer line/space is 45/45 µm for prototype/sample. Production values are 45/50 µm, subject to copper, finish, feature density and the complete design.
Yes, these structures can be reviewed when the layer span, drill size, pads, fill/cap requirements and stacked or staggered arrangement are defined. Feasibility is confirmed from the complete stack-up and process route.
The stated tolerance is ±9% for prototype/sample and ±10% for production. The stack-up, trace geometry, finished copper, reference planes, coupon and test method must be agreed together.
Inner-layer copper is stated at 0.33–5 oz for prototype/sample and 0.33–4 oz for production. Outer-layer copper is 0.33–5 oz for both; achievable line/space and plating must be evaluated with copper weight.
Options include ENIG, OSP, OSP plus ENIG, ENEPIG and plated gold fingers. Selection depends on assembly, contact, storage and project-specific requirements.
Provide board and drill data, fabrication drawing, released stack-up, material and copper, via table, impedance requirements, finish, panel format, inspection criteria, quantities and target date.
Material availability, stack-up approval, engineering-question closure, lamination and via complexity, panel layout, finish, special processes, testing and quantity determine the confirmed schedule.
